The EB60V edgebanding gun replaces open glue roller systems with slot nozzle technology for consistent adhesive application to board or banding. Apply a wide range of hot melt adhesives, including EVA, polyolefin and PUR materials for edgebanding and back-edge sealing.

• Eliminate airborne contamination with closed system to reduce maintenance, cleaning and labor costs.
  
  
• Reduce material consumption with better adhesive control and metering.
  
  
• Produce accurate coating weights with positive application pressure to substrate.
  
  
• Maintain consistent bonding quality and material characteristics with precise temperature control for constant adhesive viscosity and prevention of charring or premature curing.
  
  
• Speed installation and changeovers with scale readout for easy width adjustments up to 60 millimeters (2.4 in.).