Summit™ Lamination Applicator

Summit lamination applicators provide exceptional control of hot melt adhesive fiber deposition with low add-on rates. Controlled adhesive fiber deposition in a cross-web direction improves bond performance.

Increase bond strength and prevent substrate distortion with superior control of adhesive fiber size, density and pattern width.
Reduce adhesive consumption and improve product appearance with add-on rates as low as 1 gram per square meter at 1,000 feet per minute (300 mpm).
Minimize adhesive waste with edge control within ±2 mm without overspray.
Gain pattern flexibility with adhesive fiber sizes ranging from 50 to 100 microns.
Produce low-density large-fiber patterns for maximum bond strength, open patterns for absorbency, or highly dense fine-fiber patterns for heat-sensitive substrates.
Choose from nozzles in full- and partial-width designs, providing a high degree of pattern-width resolution.
Choose from three nozzles designs that include a 22.3-mm-wide SM200, 25-mm-wide Universal™ style, and 50-mm-wide SW200.
Produce right- or left-biased patterns with symmetrical Universal lamination nozzles.